Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Patent
1997-08-05
1998-12-08
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
361737, 439946, H01R 909
Patent
active
058460926
ABSTRACT:
An IC card adapter includes a printed circuit board attached on a first edge to solder tails extending from a first connector and on an opposing second edge to solder tails extending from a second connector. The printed circuit board, first connector and second connector form a subassembly. The subassembly is provided with a first keyed interlock surface which mates with a second keyed interlock surface on a lower molded housing adapted to receive the subassembly. The first and second keyed interlock surfaces orient the subassembly and lower housing. The lower molded housing also includes a first latching member which snap-fits with a second latching member on an upper molded housing. When the lower and upper housings are engaged, they define a cavity which encloses the printed circuit board.
REFERENCES:
patent: 4531176 (1985-07-01), Beecher, II
patent: 5017767 (1991-05-01), Mizuno
patent: 5313364 (1994-05-01), Omori et al.
patent: 5339222 (1994-08-01), Simmons et al.
patent: 5414253 (1995-05-01), Baudouin et al.
patent: 5430618 (1995-07-01), Huang
patent: 5510959 (1996-04-01), Derstine et al.
patent: 5541448 (1996-07-01), Carpenter
patent: 5546278 (1996-08-01), Bethurum
patent: 5547397 (1996-08-01), Hirai
patent: 5548483 (1996-08-01), Feldman
patent: 5548485 (1996-08-01), Bethurum et al.
patent: 5574628 (1996-11-01), Persia et al.
patent: 5600543 (1997-02-01), Sanemitsu
patent: 5608607 (1997-03-01), Dittmer
patent: 5617297 (1997-04-01), Lo et al.
patent: 5617627 (1997-04-01), Semple et al.
Bashkin Michael
Feldman Steven
Abrams Neil
McNutt Matthew B.
Minnesota Mining and Manufacturing Company
Standig Barry M. L.
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