Plasma vapor deposition film forming apparatus

Details Plasma vapor deposition film forming apparatus Plasma vapor deposition film forming apparatus

1984-09-06

1985-09-10

Smith, John D.

Coating apparatus

Gas or vapor deposition

With treating means

118 501, 118719, 427 39, C23C 1308

Patent

active

045399344

ABSTRACT:
In a vapor deposition film forming apparatus having a plurality of reactors each having a substrate and an electrode oppositely arranged in a vacuum chamber and means for applying a voltage thereacross to react or decompose reaction gas introduced into the vacuum chamber, the reactors are arranged on the circumference of a circle and exhaust pipes having substantially equal exhaust resistance radially extend to the reactors from a common exhaust pipe located at the center of the circle.

REFERENCES:
patent: 4226208 (1980-10-01), Nishida et al.
patent: 4369730 (1983-01-01), Izu et al.
patent: 4466380 (1984-08-01), Jansen et al.
patent: 4482419 (1984-11-01), Tsukada et al.

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