Plasma treatment method

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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156627, 118723, 427 10, H01L 2100

Patent

active

051731460

ABSTRACT:
Method and apparatus for improving the surface quality of a resin molding by treating it with a plasma gas, measuring and integrating ion density and stopping the treatment when the integration reaches a predetermined value.

REFERENCES:
patent: 4207137 (1980-06-01), Tretola
patent: 4316791 (1982-02-01), Taillet
patent: 4479848 (1984-10-01), Otsubo
patent: 4579623 (1986-04-01), Suzuki et al.
patent: 4767496 (1988-08-01), Hilber
patent: 4960073 (1990-10-01), Suzuki et al.
"Plasma Etching in Semiconductor Fabrication"; Russ A. Morgan; .COPYRGT.1985 pp. 143-203.

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