Plasma treatment for metal oxide electrodes

Details Plasma treatment for metal oxide electrodes Plasma treatment for metal oxide electrodes

1997-11-25

2000-06-27

Mayekar, Kishor

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

429219, 429222, B01J 1908

Patent

active

060802839

ABSTRACT:
A process for reducing the surface of a metal oxide substrate, such as silver oxide, to form a layer of its metal, such as silver, on the metal oxide substrate by contacting the substrate with a plasma gas excited by a plasma generator.

REFERENCES:
patent: 3055964 (1962-09-01), Solomon et al.
patent: 3336211 (1967-08-01), Ray
patent: 3615858 (1971-10-01), Soto-Krebs
patent: 3655450 (1972-04-01), Soto-Krebs
patent: 3920478 (1975-11-01), Kozawa
patent: 3925102 (1975-12-01), Dozawa
patent: 4009056 (1977-02-01), Megahed
patent: 4015056 (1977-03-01), Megahed
patent: 4021598 (1977-05-01), Naruishi
patent: 4038467 (1977-07-01), Lippold
patent: 4048405 (1977-09-01), Meghed
patent: 4068049 (1978-01-01), Naruishi
patent: 4125689 (1978-11-01), Jumel
patent: 4209578 (1980-06-01), Balters
patent: 4250234 (1981-02-01), Langan
patent: 5089199 (1992-02-01), Fujiwara et al.
patent: 5339873 (1994-08-01), Feldstein
patent: 5411821 (1995-05-01), Feldstein
Kirk-Othmer, Encyclopedia of Chemical Technology vol. 10, 1980 3rd ed., pp. 262-265. No month available.
F. Brecelj and M. Mozetic, "Reduction of metal oxide thin layers by hydrogen plasma", Vacuum, Technology Applications et Ion Physics, vol. 40, No.1/2, 1990, pp. 177-178. No Month Available.

Affiliated with

Also associated with

Rating

Plasma treatment for metal oxide electrodes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma treatment for metal oxide electrodes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma treatment for metal oxide electrodes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1781219