Etching a substrate: processes – Gas phase etching of substrate
Reexamination Certificate
2007-03-20
2010-12-14
Vinh, Lan (Department: 1713)
Etching a substrate: processes
Gas phase etching of substrate
C216S063000, C216S067000, C156S345290, C156S345350, C156S345390
Reexamination Certificate
active
07850864
ABSTRACT:
There are proposed a plasma treating apparatus and a plasma treating method using the same capable of improving the durability of site, member and parts in a chamber used for plasma etching in a corrosive gas atmosphere, which are exposed to the plasma atmosphere, and improving the resistance to plasma erosion of a coating formed on the surface of the member or the like in the corrosive gas atmosphere and preventing the occurrence of particles of a corrosion product even under a high plasma power. As a means therefore, in a plasma treating apparatus wherein a surface of a body to be treated in a chamber is subjected to a plasma treatment with an etching gas, at least surfaces of sites of the chamber itself exposing to the plasma atmosphere, or surfaces of a member or parts accommodated in the chamber are covered with a composite layer including a porous layer made from a metal oxide and a secondary recrystallized layer of the metal oxide formed on the porous layer.
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Angadi Maki A
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tokyo Electron Limited
Vinh Lan
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