Plasma processing system

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means

Reexamination Certificate

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C118S7230AN

Reexamination Certificate

active

11144386

ABSTRACT:
A plasma processing system includes a plasma processing chamber and a plasma confining portion for defining a plasma confined area in the processing chamber. The plasma confining portion includes a plurality of spaced-apart segments arranged in a structural array. An X-axis control portion is provided for moving the plasma confining portion in a direction to expand or contract the plasma confining area. The plasma confining portion typically includes a plurality of confining members disposed one another in a vertical plane and spaced from each other.

REFERENCES:
patent: 5534751 (1996-07-01), Lenz et al.
patent: 6019060 (2000-02-01), Lenz
patent: 6492774 (2002-12-01), Han et al.
patent: 6823815 (2004-11-01), Han et al.
patent: 6872281 (2005-03-01), Chen et al.
patent: 7033444 (2006-04-01), Komino et al.
patent: 7094315 (2006-08-01), Chen et al.
patent: 2005/0039682 (2005-02-01), Dhindsa et al.
patent: 7-22388 (1995-01-01), None
patent: 2003-0066595 (2003-08-01), None
English language abstract of the Japanese Publication No. 7-22388.
English language abstract of the Korean Publication No. 2003-0066595.

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