Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2008-09-30
2008-09-30
Tran, Thuy Vinh (Department: 2821)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C118S7230AN
Reexamination Certificate
active
11144386
ABSTRACT:
A plasma processing system includes a plasma processing chamber and a plasma confining portion for defining a plasma confined area in the processing chamber. The plasma confining portion includes a plurality of spaced-apart segments arranged in a structural array. An X-axis control portion is provided for moving the plasma confining portion in a direction to expand or contract the plasma confining area. The plasma confining portion typically includes a plurality of confining members disposed one another in a vertical plane and spaced from each other.
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English language abstract of the Japanese Publication No. 7-22388.
English language abstract of the Korean Publication No. 2003-0066595.
Marger & Johnson & McCollom, P.C.
Tran Thuy Vinh
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