Plasma processing method and plasma processing apparatus

Details Plasma processing method and plasma processing apparatus Plasma processing method and plasma processing apparatus

2007-03-01

2011-12-27

Ahmed, Shamim (Department: 1713)

Coating processes

Electrical product produced

C427S569000, C219S121360, C118S7230ER, C315S111210

Reexamination Certificate

active

08084080

ABSTRACT:
A plasma processing is performed by providing a first and a second electrodes to be relatively parallelly movable, disposing an object to be processed on the second electrode so as to face the first electrode and providing a blocking member to both end portions of the second electrode, so that a plasma processing space is blocked by the blocking member when the first and second electrodes are moved relatively with each other. A voltage is applied to both the first and the second electrodes and a process gas is introduced into the plasma processing space formed between the first and second electrodes, and the plasma is irradiated to the object. The blocking member is provided so as to extend from the second electrode to the first electrode, and an upper surface of the blocking member is raised higher than a surface level of the object to be processed.

REFERENCES:
patent: 5225651 (1993-07-01), De Gelis et al.
patent: 5502355 (1996-03-01), Mashiro
patent: 6916401 (2005-07-01), Long
patent: 7595462 (2009-09-01), Uno et al.
patent: 2002/0170676 (2002-11-01), Mitrovic et al.
patent: 2004/0247790 (2004-12-01), Moriyama
patent: 2007/0065597 (2007-03-01), Kaido et al.
patent: 2007/0210036 (2007-09-01), Uno et al.
patent: 3328297 (2002-09-01), None
patent: 2002-320845 (2002-11-01), None
patent: 2005-19150 (2005-07-01), None

Affiliated with

Also associated with

Rating

Plasma processing method and plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing method and plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing method and plasma processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4307930