Plasma processing device and a method of plasma process

Coating apparatus – Gas or vapor deposition – With treating means

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Details

118723MR, 118723MA, 118725, C23C 16511

Patent

active

06161498&

ABSTRACT:
Disclosed is a plasma process apparatus which permits generating microwaves and a magnetic field so as to bring about electron cyclotron resonance and, thus, to generate a plasma which is applied to a semiconductor wafer, comprising microwave generating means for generating said microwaves, microwave transmitting means for transmitting the microwaves, a process chamber having said semiconductor wafer arranged therein, the microwaves being introduced into said process chamber through said microwave transmitting means, process gas supply means for supplying a process gas into said process chamber, and magnetic field generating means for generating a magnetic field within the process chamber. The frequency of the microwave falls within a range between a lower limit of a cutoff frequency determined by the inner diameter of the process chamber and an upper limit of a maximum frequency at which a standing wave of the microwave does not occur on the surface of the object.

REFERENCES:
patent: 4915979 (1990-04-01), Ishida et al.
patent: 5069928 (1991-12-01), Echizen et al.
patent: 5153406 (1992-10-01), Smith
patent: 5192849 (1993-03-01), Moslehi
patent: 5389154 (1995-02-01), Hiroshi et al.
patent: 5714010 (1998-02-01), Matsuyama et al.

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