Plasma processing apparatus including three bus structures

Details Plasma processing apparatus including three bus structures Plasma processing apparatus including three bus structures

1990-01-22

1991-10-29

Niebling, John

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

156345, 156643, 20429803, 20429833, 20429834, 20429839, C23C 1400

Patent

active

050613596

ABSTRACT:
A system for plasma etching predetermined portions of material on the major surfaces of a plurality of substrates. The system comprises a plurality of electrodes substantially parallel to each other and to substrates alternating therewith. Each of the electrodes is of a hollow configuration and includes a pair of flat sides, each side having a plurality of tapered apertures therein. A means for directing a reactive gas through the apertures toward the substrates is provided. A first bus structure electrically connects the substrates and may be grounded. A second bus structure electrically connects alternate ones of the electrodes and is connected to a first radio frequency power source. A third bus structure electrically connects the remaining ones of the electrodes and is connected to a second radio frequency power source adapted to operate 180 degrees out of phase with the first power source.

REFERENCES:
patent: 4264393 (1981-04-01), Gorin et al.
patent: 4282077 (1981-08-01), Reavill
patent: 4297162 (1981-10-01), Mundt jet al.
patent: 4425210 (1984-01-01), Fazlin
patent: 4601807 (1986-07-01), Lo et al.

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