Plasma processing apparatus including a plurality of plasma...

Details Plasma processing apparatus including a plurality of plasma... Plasma processing apparatus including a plurality of plasma...

2007-06-05

2007-06-05

Hassanzadeh, Parviz (Department: 1763)

Coating apparatus

Gas or vapor deposition

With treating means

C156S345440

Reexamination Certificate

active

10811034

ABSTRACT:
A plasma processing apparatus comprising a plurality of plasma processing units is provided. Each of the plasma processing units has a matching circuit connected between a radiofrequency generator and a plasma excitation electrode. Among these plasma processing units, a variation <RA> between the maximum and minimum values of input-terminal-side AC resistances RA of the matching circuits defined by <RA>=(RAmax−RAmin)/(RAmax+RAmin) is adjusted to be less than 0.5. A variation between the maximum and minimum values of output-terminal-side AC resistances RB of the matching circuits defined by <RB>=(RBmax−RBmin)/(RBmax+RBmin) is also adjusted to be less than 0.5. The plasma processing units can be adjusted to achieve substantially uniform plasma results in a shorter period of time.

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Office Action dated Jun. 10, 2003 for corresponding Japanese Patent Application No. 2000-341076.

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