Plasma processing apparatus and plasma processing method

Details Plasma processing apparatus and plasma processing method Plasma processing apparatus and plasma processing method

2011-08-30

2011-08-30

Maldonado, Julio J (Department: 2823)

Coating apparatus

Gas or vapor deposition

With treating means

C118S7230AN, C118S7230ME, C118S7230MW, C156S345410, C156S345360

Reexamination Certificate

active

08006640

ABSTRACT:
A plasma processing apparatus includes: a process container configured to accommodate a target object and hold a vacuum therein for performing a plasma process; a worktable configured to place the target object thereon inside the process container; a planar antenna including a plurality of slots and configured to supply microwaves into the process container; a gas feed mechanism configured to supply a process gas into the process container; and a top plate disposed opposite the worktable, the top plate being set at a position separated from the target object placed on the worktable by a distance of 20 mm or more and 100 mm or less.

REFERENCES:
patent: 5478403 (1995-12-01), Shinagawa et al.
patent: 6091045 (2000-07-01), Mabuchi et al.
patent: 6388632 (2002-05-01), Murakawa et al.
patent: 6470824 (2002-10-01), Kawakami et al.
patent: 6953908 (2005-10-01), Ishii et al.
patent: 6987056 (2006-01-01), Lim et al.
patent: 7098147 (2006-08-01), Nansei et al.
patent: 2002/0022375 (2002-02-01), Kwon
patent: 2004/0094094 (2004-05-01), Ohmi et al.
patent: 2004/0250771 (2004-12-01), Ozaki et al.
patent: 2000-260767 (2000-09-01), None
patent: 2002-299240 (2002-10-01), None
patent: 2003-59919 (2003-02-01), None
patent: 2003-115587 (2003-04-01), None
patent: 1993-0004115 (1993-05-01), None
patent: 2002-0011022 (2002-02-01), None

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