Plasma processing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118723MW, C23F 102

Patent

active

061561525

ABSTRACT:
Provided is a plasma processing apparatus capable of extending an etching parameter to reduce charge-up shape anomalies in dry etching and to enhance etching performance such as selectivity, uniformity, processability or the like. A microwave is controlled to be modulated in frequency and is introduced into a chamber. An ECR face is moved between two positions according to the frequency of the microwave.

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