Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-06-06
1999-07-06
Wortman, Donna C.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118723E, C23F 102, C23C 1600
Patent
active
059193328
ABSTRACT:
A lower insulating member 13 is arranged around a suscepter 6 as a lower electrode, and an upper insulating member 31 is arranged around an upper electrode 21. An outer end portion 31a of the upper insulating member is positioned outside an lower insulating member 13, to be lower than the upper surface of a wafer W. The narrowest distance between the lower insulating member 13 and the upper insulating member 31 is arranged to be smaller than a gap G between electrodes. Diffusion of a plasma generated between electrodes is restricted and prevented from spreading to the sides, so that inner walls of a processing container 3 are not sputtered.
REFERENCES:
patent: 5529657 (1996-06-01), Ishii
Aoki Makoto
Hirose Keizo
Koshiishi Akira
Nagaseki Kazuya
Ogasawara Masahiro
Brumback Brenda G.
Tokyo Electron Limited
Wortman Donna C.
LandOfFree
Plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-896533