Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With radio frequency antenna or inductive coil gas...
Reexamination Certificate
2009-09-25
2010-06-29
Hassanzadeh, Parviz (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With radio frequency antenna or inductive coil gas...
C118S7230IR
Reexamination Certificate
active
07744721
ABSTRACT:
A plasma processing apparatus including a processing chamber for subjecting an object to plasma processing, a gas inlet, an evacuation device, a sample stage for the object, a power supply, and at least one induction coil. The at least one induction coil enables generation of the plasma in the processing chamber and is formed by connecting a plurality of identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage.
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Kushner, Mark J., et al, “A Three-Dimensional Model for Inductively Coupled Plasma Etching Reactors: Azimuthal Symmetry, Coil Properties, and Comparison to Experiments,” J. Appl. Phys. 80 (3), Aug. 1996, pp. 1337-1344. USA.
Okumura, T., et al, “New Inductively Coupled Plasma Source Using a Multispiral Coil,” Rev. Sci. Instrum. vol. 66, No. 11, Nov. 1995, pp. 5262-5265.
Edamura Manabu
Miya Go
Yoshioka Ken
Antonelli, Terry Stout & Kraus, LLP.
Gramaglia Maureen
Hassanzadeh Parviz
Hitachi High-Technologies Corporation
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