Plasma processing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

20429837, 20429838, 118723MR, 118723E, C23F 102

Patent

active

057334056

ABSTRACT:
A plasma processing apparatus capable of forming plasma uniformly throughout a large surface area whereby a sample having a large diameter can be uniformly processed. The plasma processing apparatus has a first electrode 3 on which a workpiece 2 is placed, a second electrode 4 located to face the first electrode 3, and a plurality of ring-shaped permanent magnets 11 each having the same polarity in their circumferential direction, and the magnets are disposed concentrically or the outer side of the second electrode 4 so that the polarities opposing in the radial direction of adjacent magnets 11 are opposite to each other.

REFERENCES:
patent: 4838978 (1989-06-01), Sekine et al.
patent: 5108535 (1992-04-01), Ono et al.
patent: 5279669 (1994-01-01), Lee

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