Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent
1997-10-23
1999-07-13
Dixon, Merrick
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
428447, 428355, 428339, 427489, 427491, 427534, 427539, 524265, 524266, 524262, 524157, 528 31, 528 43, B32B 712
Patent
active
059224592
ABSTRACT:
A plasma-polymerized anti-fogging film is formed by polymerization-depositing a high molecular polymerized DMDAS film on a substrate to provide the substrate surface with anti-fogging capability. The plasma polymerization deposition process is performed by using diacetoxy silane monomer that contains bi-carboxylate O.dbd.C--O-- functional group as the reactant monomer with an introduction of a suitable amount of oxygen to cause the polymerization reaction. The reactant monomer and the oxygen are introduced into a vacuum deposition apparatus and a high energy plasma is generated between electrodes of the vacuum deposition apparatus to cause the polymerization reaction on the substrate to form thereon the high molecular polymerized DMDAS anti-fogging film.
REFERENCES:
patent: 3392133 (1968-07-01), Stickelmeyer et al.
patent: 4463114 (1984-07-01), Balchunis et al.
patent: 4532185 (1985-07-01), Balchunis et al.
patent: 5427807 (1995-06-01), Chum et al.
patent: 5451460 (1995-09-01), Lu et al.
patent: 5487920 (1996-01-01), Lopata et al.
Huang Dao-Yang
Wei Chao-Tsang
Dixon Merrick
Industrial Technology Research Institute
Liauh W. Wayne
LandOfFree
Plasma-polymerized DMDAS anti-fogging film and method for manufa does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma-polymerized DMDAS anti-fogging film and method for manufa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma-polymerized DMDAS anti-fogging film and method for manufa will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2274381