Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1978-01-23
1979-10-09
Newsome, John H.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
96 15R, 204192N, B05D 306
Patent
active
041706625
ABSTRACT:
A method for forming on a substrate a relatively thick, densified, essentially non-porous, fine-grained layer of a non-conductive material. The method comprises the steps of vapor depositing onto such substrate a starting material while simultaneously bombarding the substrate with ions of a preselected gas. During the process, the substrate is disposed in the atmosphere of a preselected gas, and an RF field is established between the substrate and an opposing electrode structure to produce a plasma of such gas in the vicinity of the substrate. The substrate is electrically biased to attract ions from the plasma, such ions serving to impact on the substrate and thereby densify the vapor deposit thereon. Preferably, the starting material is one which reacts with the gas ions to form the desired material on the substrate; alternatively, the starting material comprises the desired material, in which case the gas plasma preferably comprises an inert gas.
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patent: 3419487 (1968-12-01), Robbins et al.
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Vossen et al. I, "RCA Review", Dec. 1968, pp. 566-581.
Vossen et al. II, "RCA Review", Jun. 1970, pp. 293-305.
Leder, "Metal Finishing", Mar. 1974, pp. 41-45.
Mattox, "J. Vac. Sci. Technol.", Vol. 10, No. 1, Jan./Feb. 1973, pp. 47-52.
Clarke John R.
Weiss Armin K.
Eastman Kodak Company
Kurz Warren W.
Newsome John H.
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