Plasma method for forming a metal containing polymer

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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156643, 427 39, 427253, 428422, B05D 110, C23C 1302

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active

042268966

ABSTRACT:
A plasma process for forming a polymer film containing metal therein includes the steps of providing an electrode of a metal that can be etched by a halogen, providing a substrate for the polymer film to be deposited thereon, and passing a halocarbon monomer through a plasma system so that the metal etched from the electrode forms a volatile halide and is incorporated in the polymer film that is deposited on the substrate.

REFERENCES:
patent: 3732158 (1973-05-01), Przybyszewski et al.
patent: 3867216 (1975-02-01), Jacob
patent: 3912461 (1975-10-01), Wakefield
patent: 3971684 (1976-07-01), Muto
patent: 3984301 (1976-10-01), Matsuzaki et al.
patent: 4013532 (1977-03-01), Cormia et al.
patent: 4026742 (1977-05-01), Fujino
patent: 4091166 (1978-05-01), Kubacki

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