Radiant energy – Photocells; circuits and apparatus – Flame light source
Reexamination Certificate
2007-05-15
2007-05-15
Lee, John R. (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Flame light source
C250S226000
Reexamination Certificate
active
10644745
ABSTRACT:
In a plasma processing apparatus that forms plasma from a process gas by supplying the process gas into a processing container and applying high-frequency power to an electrode provided inside the processing container on which a workpiece is placed and executes specific plasma processing on the processing surface of the workpiece, apparatus state parameter data indicating a state of the plasma processing apparatus are obtained through measurement executed by a parameter measuring instrument, optical data are obtained through measurement executed by an optical measuring instrument and electrical data are obtained through measurement executed by an electrical measuring instrument. A means for plasma leak judgment judges that a plasma leak has occurred if there is a fluctuation in the data.
REFERENCES:
patent: 6791692 (2004-09-01), Powell et al.
patent: 2003/0085662 (2003-05-01), Kwon et al.
patent: 2003/0205460 (2003-11-01), Buda
patent: 2004/0168771 (2004-09-01), Mitrovic
patent: 64-081197 (1989-03-01), None
patent: 2000-100795 (2000-04-01), None
patent: 2001-319922 (2001-11-01), None
patent: WO 00/03421 (2000-01-01), None
English Abstract of JP 64-081197.
English Abstract of JP 2000-100795.
English Abstract of JP 2001-319922.
Finnegan Henderson Farabow Garrett & Dunner LLP
Lee John R.
Tokyo Electron Limited
LandOfFree
Plasma leak monitoring method, plasma processing apparatus... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma leak monitoring method, plasma processing apparatus..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma leak monitoring method, plasma processing apparatus... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3763939