Plasma immersion ion processor for fabricating semiconductor int

Coating apparatus – Gas or vapor deposition – With treating means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118723AN, 156345, 156 89, 427 38, C23C 1600

Patent

active

060559284

ABSTRACT:
An apparatus and method for fabricating a spherical shaped semiconductor integrated circuit according to which a chamber is provided into which spheres of a semiconductor material are introduced therein. Process gases are also selectively introduced into the chamber. The chamber includes a metallic portion that is selectively provided a voltage. Upon receiving the voltage, the chamber attracts ions from the process gases, at least some of the attracted ions treating the spheres according to a particular aspect of the fabrication process.

REFERENCES:
patent: 4272351 (1981-06-01), Kotani et al.
patent: 4582720 (1986-04-01), Yamazaki
patent: 4652318 (1987-03-01), Masuda et al.
patent: 5178739 (1993-01-01), Barnes et al.
patent: 5571366 (1996-11-01), Ishii et al.
patent: 5592581 (1997-01-01), Okase
patent: 5904780 (1999-05-01), Tomoyasu
U.S. Serial No. 08/858,044, filed on May 16, 1997, entitled Spherical Shaped Semiconductor Integrated Circuit, Akira Ishikawa, Abstract and 15 sheets of drawings.
U.S. Serial No. 08/996,260, filed on Dec. 22, 1997, entitled Apparatus and Method For Fabricating Spherical Shaped Semiconductor Integrated Circuits, Ohkusa et al., Abstract and 1 sheet of drawings.
X.Y. Qian et al., Plasma Immersion Ion Implantation of SeF.sub.4 and BF.sub.3 for sub-100 nm P.sub.+ IN Junction Fabrication, Appl. Phys. Lett. 59(3), Jul. 15, 1991, at 348.
Meng-Hsiung Kiang et al., PD/Si Plasma Immersion Ion Implantation for Selective Electroless Copper Plating on SiO.sub.2, Appl Phys. Lett. 60 (22), Jun. 1, 1992, at 2767.
Andre Anders et al., Metal Plasma Immersion Ion Implantation and Deposition Using Vacuum Arc Plasma Sources, J. Vac. Sci. Technol. B, Mar./Apr. 1994, at 815.
Paul K. Chu et al., Recent Applications of Plasma Immersion Ion Implantation, Semiconductor International, Jun. 1996, at 165.
Donald J. Rej, Plasma Immersion Ion Implantation (PIII), Handbook of Thin Film Process Technology, 1996, at E2.3:1.
R.J. Matyi et al, Materials Properties of B-Doped Si by Low Energy Plasma Source Ion Implantation, 1997, at 749.
S.B. Felch et al., Formation of Deep Sub-Micron Buried Channel pMOSFETs with Plasma Doping.
C.M. Osburn, Ultra-Shallow Junction Formation Using Very Low Engery B and BF.sub.2 Sources, at 607.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma immersion ion processor for fabricating semiconductor int does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma immersion ion processor for fabricating semiconductor int, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma immersion ion processor for fabricating semiconductor int will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1585694

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.