Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2011-07-12
2011-07-12
Hassanzadeh, Parviz (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C118S7230MW, C219S121480, C219S121500
Reexamination Certificate
active
07976672
ABSTRACT:
A plasma generation apparatus is provided which includes: a microwave generation portion which generates a microwave; a gas supply portion which supplies a gas to be turned into plasma; a plasma generation nozzle which includes a reception member receiving the microwave, and turns the gas into plasma based on the energy of the received microwave and emits the plasma gas; and a photo-detection unit which detects light emitted by the plasma gas and generates electrical information.
REFERENCES:
patent: 3911318 (1975-10-01), Spero et al.
patent: 4151034 (1979-04-01), Yamamoto et al.
patent: 4185213 (1980-01-01), Scannell
patent: 4609808 (1986-09-01), Bloyet et al.
patent: 4611108 (1986-09-01), Leprince et al.
patent: 4652723 (1987-03-01), Guy et al.
patent: 4711627 (1987-12-01), Oeschsle et al.
patent: 5083004 (1992-01-01), Wells et al.
patent: 5114770 (1992-05-01), Echizen et al.
patent: 5349154 (1994-09-01), Harker et al.
patent: 5565118 (1996-10-01), Asquith
patent: 5645796 (1997-07-01), Caputo et al.
patent: 5679167 (1997-10-01), Muehlberger
patent: 5689949 (1997-11-01), DeFreitas et al.
patent: 5793013 (1998-08-01), Read et al.
patent: 5972302 (1999-10-01), Tranquilla et al.
patent: 5994663 (1999-11-01), Lu
patent: 6039834 (2000-03-01), Tanaka et al.
patent: 6125859 (2000-10-01), Kao et al.
patent: 6157867 (2000-12-01), Hwang et al.
patent: 6230652 (2001-05-01), Tanaka et al.
patent: 6262386 (2001-07-01), Fornsel
patent: 6388225 (2002-05-01), Blum et al.
patent: 6417013 (2002-07-01), Teixeira et al.
patent: 6525481 (2003-02-01), Milos et al.
patent: 6673200 (2004-01-01), Shinqun et al.
patent: 6734385 (2004-05-01), Byung et al.
patent: 6936842 (2005-08-01), Rengarajan et al.
patent: 7164095 (2007-01-01), Lee et al.
patent: 7338575 (2008-03-01), Pingree, Jr. et al.
patent: 7554054 (2009-06-01), Takada et al.
patent: 2001/0024114 (2001-09-01), Kitagawa et al.
patent: 2002/0020691 (2002-02-01), Jewett et al.
patent: 2002/0050323 (2002-05-01), Moisan et al.
patent: 2003/0000823 (2003-01-01), Uhm et al.
patent: 2003/0032207 (2003-02-01), Rengarajan et al.
patent: 2003/0085000 (2003-05-01), Horioka et al.
patent: 2003/0178140 (2003-09-01), Hamazaki et al.
patent: 2003/0199108 (2003-10-01), Tanaka et al.
patent: 2004/0007326 (2004-01-01), Roche et al.
patent: 2004/0016402 (2004-01-01), Walther et al.
patent: 2004/0079287 (2004-04-01), Smith et al.
patent: 2004/0083797 (2004-05-01), Ward et al.
patent: 2004/0096581 (2004-05-01), Yashiro et al.
patent: 2004/0173583 (2004-09-01), Iriyama et al.
patent: 2004/0262268 (2004-12-01), Wu
patent: 2005/0009347 (2005-01-01), Matsumoto et al.
patent: 2006/0006153 (2006-01-01), Lee et al.
patent: 2006/0021581 (2006-02-01), Lee et al.
patent: 2006/0021980 (2006-02-01), Lee et al.
patent: 2006/0042546 (2006-03-01), Ishii et al.
patent: 2006/0057016 (2006-03-01), Kumar et al.
patent: 2006/0086699 (2006-04-01), Holber et al.
patent: 2007/0221634 (2007-09-01), Condick
patent: 2008/0017616 (2008-01-01), Lee et al.
patent: 2008/0029030 (2008-02-01), Goto et al.
patent: 2008/0073202 (2008-03-01), Lee et al.
patent: 2008/0093358 (2008-04-01), Lee et al.
patent: 2010/0201272 (2010-08-01), Lee
patent: 2704179 (2005-06-01), None
patent: 101137267 (2008-03-01), None
patent: 0 397 468 (1990-11-01), None
patent: 60-046029 (1985-03-01), None
patent: 60-502243 (1985-12-01), None
patent: 62-81274 (1987-04-01), None
patent: 62-228482 (1987-10-01), None
patent: 1-297826 (1989-11-01), None
patent: 3-075318 (1991-03-01), None
patent: 5-146879 (1993-06-01), None
patent: 6-013329 (1994-01-01), None
patent: 6-244140 (1994-09-01), None
patent: 7-135196 (1995-05-01), None
patent: 7-258828 (1995-10-01), None
patent: 9-169595 (1997-06-01), None
patent: 10-189292 (1998-07-01), None
patent: 10-284296 (1998-10-01), None
patent: 2001-044177 (2001-02-01), None
patent: 2001-502110 (2001-02-01), None
patent: 2001-068298 (2001-03-01), None
patent: 2002-124398 (2002-04-01), None
patent: 2003-033862 (2003-02-01), None
patent: 2003-059917 (2003-02-01), None
patent: 2003-086580 (2003-03-01), None
patent: 2003-133302 (2003-05-01), None
patent: 2003-167017 (2003-06-01), None
patent: 2003-171785 (2003-06-01), None
patent: 2003-197397 (2003-07-01), None
patent: 2003-213414 (2003-07-01), None
patent: 2004-006211 (2004-01-01), None
patent: 2004-237321 (2004-08-01), None
patent: 2004-285187 (2004-10-01), None
patent: 2005-002355 (2005-01-01), None
patent: 2005-095744 (2005-04-01), None
patent: 2005-116217 (2005-04-01), None
patent: 2005-230837 (2005-09-01), None
patent: 2005-235464 (2005-09-01), None
patent: 2005-534187 (2005-11-01), None
patent: 2006-121073 (2006-05-01), None
patent: 2007-530955 (2007-11-01), None
patent: 2008-508683 (2008-03-01), None
patent: 2006-0001944 (2006-01-01), None
patent: WO-2004-010746 (2004-01-01), None
patent: WO-2005/096681 (2005-10-01), None
patent: WO-2006/014862 (2006-02-01), None
Zhao, W., Tian, K., Liu, D., and Tang, H. (2002) Fluctuations of the core and the jet shape of an arc plasma spraying jet. Journal of Tsinghua University (Sci&Tech), vol. 42, No. 4, 442-445.
U.S. Appl. No. 11/631,723, filed Jan. 4, 2007, Lee et al.
U.S. Appl. No. 11/661,048, filed Feb. 22, 2007, Lee et al.
U.S. Appl. No. 11/661,067, filed Feb. 22, 2007, Lee et al.
U.S. Appl. No. 12/284,570, filed Sep. 23, 2008, Lee.
U.S. Appl. No. 12/291,646, filed Nov. 12, 2008, Lee.
U.S. Appl. No. 12/315,913, filed Dec. 8, 2008, Lee.
U.S. Appl. No. 12/322,909, filed Feb. 9, 2009, Lee.
U.S. Appl. No. 12/380,835, filed Mar. 4, 2009, Lee.
U.S. Appl. No. 12/384,536, filed Apr. 6, 2009, Lee et al.
U.S. Appl. No. 12/386,578, filed Apr. 21, 2009, Lee et al.
Hayashi Hirofumi
Iwasaki Ryuichi
Mankawa Hirofumi
Masuda Shigeru
Matsuuchi Hidetaka
Dhingra Rakesh
Hassanzadeh Parviz
Jordan and Hamburg LLP
Saian Corporation
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