Plasma-etching electrode plate

Details Plasma-etching electrode plate Plasma-etching electrode plate

1997-02-14

1999-11-30

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

20429831, H05H 146

Patent

active

059935960

ABSTRACT:
A plasma-etching electrode plate of glassy carbon is characterized by a thickness greater than 4.5 mm and a thermal conductivity greater than 5 W/m.multidot.K at 300K. Due to these characteristic properties, it has a uniform surface temperature distribution and permits etching on large semiconductor wafers (in excess of 8 inches in diameter) at a uniform etch rate. In addition, it is capable of stable etching for a long time and has a greatly improved durability. The glassy carbon should preferably be one which has a bulk specific gravity higher than 1.53 g/cc. The glassy carbon is obtained from one or more of thermosetting resin having a carbon yield higher than 20%.

REFERENCES:
patent: 5074456 (1991-12-01), Degner et al.
patent: 5324411 (1994-06-01), Ichishima et al.

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