Plasma-etching electrode plate

Details Plasma-etching electrode plate Plasma-etching electrode plate

1997-02-14

1998-12-29

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, C23F 102

Patent

active

058535233

ABSTRACT:
A plasma-etching electrode plate in the form of flat glassy carbon plate is characterized by a flatness with a warp smaller than 0.3 mm. This flatness permits the electrode plate to have a uniform surface temperature distribution which contributes to uniform etching on semiconductor wafers. The electrode plate is a glassy carbon plate obtained from one or more thermosetting resins having a carbon yield higher than 20%.

REFERENCES:
patent: 5017274 (1991-05-01), Kerr et al.
patent: 5074456 (1991-12-01), Degner et al.
patent: 5324411 (1994-06-01), Ichishima et al.

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