Plasma etching apparatus with accurate temperature and voltage l

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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156626, 156643, 118723, 118725, H01L 2100

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active

052270009

ABSTRACT:
A plasma etching apparatus capable of accurately controlling the voltage levels of the pins and the temperature of the device under test in the etching process. The apparatus includes: a radiator, located below the table on which the device under test is placed, for releasing heat from the table; and a thermoelectric cooling element, located between the table and the radiator, for controlling temperature of the device under test on the table. The apparatus may also includes: a detachable adaptor, fixedly mounted on the table, made by an electrically and thermally conductive material, and having at least one trapezoidal ridge with trapezoidal cross section having sloping sides inclined by an angle larger than an angle of the pins of the device under test, for holding the device under test on a top face of the trapezoidal ridge with the pins hanging along the sloping sides; and a detachable holder, fixedly attached to the adaptor over the device under test, and having an opening through which the plasmas are injected onto the device under test, for pressing down the device under test with respect to the adaptor.

REFERENCES:
patent: 4341582 (1982-07-01), Kohman et al.
patent: 4687319 (1987-08-01), Mishra
patent: 4826556 (1989-05-01), Kobayashi
patent: 4871421 (1989-03-01), Ogle et al.
patent: 4891488 (1990-01-01), Davis et al.
patent: 4956043 (1990-09-01), Kanetomoto et al.
"Perry's Handbook of Chemical Engineering"; .COPYRGT.1973; McGraw-Hill, Inc; pp. 10-3, 10-45, 10-48 to 10-50.
Patent Abstracts of Japan, vol. 11, No. 85 Oct. 1986.

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