Plasma etching apparatus and method and apparatus for verifying

Details Plasma etching apparatus and method and apparatus for verifying Plasma etching apparatus and method and apparatus for verifying

1998-05-22

2000-02-22

Wong, Edna

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118500, 118712, 118728, 269 20, 269 21, 269 23, 345345PW, 345345WH, C23F 102, B05C 1100, B23Q 300, B23Q 308, B25B 1100

Patent

active

060276053

ABSTRACT:
Wafer verifying apparatus for receiving a wafer thereagainst and for verifying the wafer, wafer verifying apparatus comprising a fixture including a stage for receiving thereagainst a surface of the wafer, a vacuum assembly for effecting a vacuum coupling of the surface of the wafer to the stage, and sensor apparatus for accepting the wafer in the presence of a vacuum couple of the surface of the wafer against the stage and for rejecting the wafer absent a vacuum couple of the surface of the wafer against the stage.

REFERENCES:
patent: 4682928 (1987-07-01), Foulke et al.
patent: 5695568 (1997-12-01), Sinha et al.

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