Plasma etch vaporous exhaust collection system

Details Plasma etch vaporous exhaust collection system Plasma etch vaporous exhaust collection system

1989-05-16

1990-11-06

Nozick, Bernard

Gas separation

With nonliquid cleaning means for separating media

Solid agent cleaning member movingly contacts apparatus

55233, 55309, 552573, B01D 4700

Patent

active

049683365

ABSTRACT:
A system for treating and removing toxic by-products of semiconductor plasma etching processes utilizes a collection box having various treatment chambers in seriatim. A heated inlet conducts a vaporous process stream into an expansion chamber where the gas is expanded. The expanded gas flows over a baffle weir into a packing chamber filled with plastic media spheres. In the upper reaches of the packing chamber but below the weir top, a deionized water atomizer sprays deionized water to humidify and cool the expanded gases which allows the water soluble toxic by-products, such as aluminum trichloride, to initially precipitate out and condense on the spheres. With continued water flow the by-products solubilize in the water and flow to an acid drain. Remaining vaporous gaseous exhaust products pass under a weir defining one side of the packing chamber up to an exhaust chamnber where a series of inclined staggered baffles and a strainer trap remove water from the gaseous exhaust and return it to the acid drain. Various pressure sensors, by-pass and shut-off arrangements assure safety and efficient operation of the system and method.

REFERENCES:
patent: 218611 (1879-08-01), Wilkinson
patent: 1476292 (1923-12-01), Galusha
patent: 3768234 (1973-10-01), Hardison
patent: 3993448 (1976-11-01), Lowery
patent: 4470830 (1984-09-01), Aubert

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