Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1989-09-06
1991-07-09
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 38, 427 451, 427 541, 118723, C23C 1648, C23C 1650
Patent
active
050304755
ABSTRACT:
A plasma or photo-induced chemical vapor deposition coating process and apparatus are provided for applying thin dielectric coatings on planar, curved, and large area substrates. A plasma is generated in a tubular outer conductor. This plasma or the UV radiation occurring in the plasma passes through an opening into a reaction chamber. The opening preferably extends axially along the outer conductor and communicates with the interior of the reaction chamber. At least one component of the reaction gas is introduced directly to the opening or into the reaction chamber adjacent to the opening, bypassing the outer conductor. In this apparatus, the reactive deposition of a coating onto a substrate occurs only in the reaction chamber and below the opening from the outer conductor.
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patent: 4526805 (1985-07-01), Yoshizawa
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patent: 4879140 (1989-11-01), Gray et al.
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Tsu et al., J. Vac. Sci & Tech. A, vol. 4, No. 3, May/Jun. 1986, pp. 480-485.
Brodsky et al., IBM Tech Disc. Bull, vol. 22, No. 8A, Jan. 1980, pp. 3391-3392.
Ackermann Ulrich
Etzkorn Heinz-Werner
Kersten Ralf T.
Paquet Volker
Rutze Uwe
Beck Shrive
Burke Margaret
Schott Glaswerke
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