Plasma enhanced chemical vapor deposited vertical silicon nitrid

Fishing – trapping – and vermin destroying

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148DIG114, 148DIG136, 357 51, 437 60, 437193, 437200, 437241, 437918, H01C 710, H01L 2904

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active

047866128

ABSTRACT:
An improved resistor for use in MOS integrated circuits. An opening is formed in an insulative layer which separates two conductive regions. A plasma enhanced chemical vapor deposition of passivation material such as silicon-rich silicon nitride is deposited in the window, contacting both conductive regions and providing resistance in a vertical direction between these regions.

REFERENCES:
patent: 4291328 (1981-09-01), Lien et al.
patent: 4403394 (1983-09-01), Shepard et al.
patent: 4406051 (1983-09-01), Iizuka
patent: 4420766 (1983-12-01), Kasten
patent: 4477310 (1984-10-01), Park et al.
patent: 4547959 (1985-10-01), Rusch
patent: 4569122 (1986-02-01), Chan
patent: 4609903 (1986-09-01), Toyokura et al.
patent: 4609935 (1986-09-01), Kondo

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