Plasma enhanced chemical vapor deposited (PECVD) silicon nitride

Semiconductor device manufacturing: process – Making passive device – Resistor

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438763, 438689, 438693, H01L 2120

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active

061272388

ABSTRACT:
A method for forming a dielectric layer within a microelectronics fabrication. There is first provided a substrate. There is then formed over the substrate a polysilicon resistor. There is then formed over the polysilicon resistor a first dielectric layer formed of a silicon nitride dielectric material deposited employing a plasma enhanced chemical vapor deposition (PECVD) method other than a high density plasma chemical vapor deposition (HDP-CVD) method. Finally, there is then formed over the first dielectric layer a second dielectric layer deposited employing a high density plasma chemical vapor deposition (HDP-CVD) method, where first dielectric layer attenuates a decrease in resistance of the polysilicon resistor incident to forming the second dielectric layer over the first dielectric layer.

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