Plasma enhanced bonding for improving adhesion and corrosion...

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

Reexamination Certificate

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Reexamination Certificate

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07629031

ABSTRACT:
Plasma Enhanced Bonding (PEB) during a coating process is used to improve both adhesion and corrosion resistance of the resulting coating. New interfacial compounds may be formed, offering the increased resistance to corrosion, as well as enhanced bonding to the workpiece being coated and any subsequently formed layer, such as diamond-like carbon. In one embodiment, the PEB processing is employed during coating of at least one interior surface of the workpiece, which may be a pipe. In a first step, a thin film is deposited. Then, the film is exposed to a high energy etch-back plasma. This two-step cycle of depositing a film and then providing bombardment of the film may be repeated a number of times. Typically, the deposition step of the cycle is much shorter than the bombardment step.

REFERENCES:
patent: 5541003 (1996-07-01), Nakayama et al.
patent: 5731045 (1998-03-01), Dearnaley et al.
patent: 6033533 (2000-03-01), Sugiyama et al.
patent: 6664182 (2003-12-01), Jeng
patent: 2006/0196419 (2006-09-01), Tudhope et al.
patent: 2006/0198965 (2006-09-01), Tudhope et al.

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