Plasma emission detection for process control via fluorescent re

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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438 7, 438 9, 216 60, H01L 2100

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active

060773871

ABSTRACT:
Method and system for monitoring a plasma etch process performed in a plasma processing chamber, the method and system being capable of accurately monitoring and controlling the plasma etch process without being affected by the change in a plasma light emission transmission characteristically caused by process polymer depositions on a detecting surface or sampling window. The system includes a plasma processing chamber having a wafer to be processed arranged therein, having at least one window to allow fluorescent light emissions to pass through, a plasma generation means for generating a plasma in the processing chamber, a fluorescent target located within the plasma processing chamber for producing a fluorescent light emission, an optical sensor external to the chamber for sensing the fluorescent light emission through the window, a detector for converting the sensed fluorescent light emissions into a signal recognizable by a controller and a controller for controlling the state of the plasma process being performed on the wafer.

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