Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2011-08-09
2011-08-09
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S014000, C438S106000, C438S109000, C438S118000, C438S460000, C257SE21214
Reexamination Certificate
active
07994026
ABSTRACT:
A plasma dicing apparatus in which a semiconductor wafer with a protective sheet stuck thereonto covering the entire circuit-forming surface and with an etching-resistant mask member stuck on the back surface opposite to the circuit-forming surface is mounted on a mounting stage; plasma etching is performed using the mask member as a mask; and the semiconductor wafer is diced into plural semiconductor chips. The plasma dicing apparatus includes a ring-shaped frame member retaining the outer circumference of the mask member extending off the outer circumference of the semiconductor wafer. The mounting stage is composed of a wafer supporting part supporting a semiconductor wafer and a frame member supporting part supporting the frame member. This facilitates carrying a semiconductor wafer into and out of the vacuum chamber.
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International Search Report issued Feb. 17, 2009 in the International (PCT) Application of which the present application is the U.S. National Stage.
Arita Kiyoshi
Harikai Atsushi
Iwai Tetsuhiro
Lee Kyoung
Panasonic Corporation
Richards N Drew
Wenderoth , Lind & Ponack, L.L.P.
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