Plasma deposition of fluorocarbon

Details Plasma deposition of fluorocarbon Plasma deposition of fluorocarbon

1991-04-30

1993-09-14

Herbert, Jr., Thomas J.

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427490, 427551, 428421, 428463, B32B 2700, B05D 306

Patent

active

052447308

ABSTRACT:
Polymeric fluorocarbon layer is prepared by plasma enhanced chemical vapor deposition in a chamber, the walls of which are coated with a polymeric fluorocarbon film by introducing a gaseous polymerizable fluorocarbon into the chamber and applying radio-frequency at a power level of about 100 to about 1000 watts, employing a pressure of about 10 to 180 mTorr and a self-bias voltage of about -50 to about -700 volts. The polymeric fluorocarbon layer is about 0.05 to about 5 .mu.m thick, has a maximum dielectric constant of about 2.5, has a C/F ratio of about 1:1 to about 1:3, is thermally stable at temperatures of at least about 350.degree. C., and is substantially free from metallic contamination and oxygen.

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