Plasma CVD process using a plurality of overlapping plasma colum

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 39, 427 38, 427 541, 427166, 118723, 118722, B05D 306

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active

050174045

ABSTRACT:
A plasma process and apparatus are provided for coating one or more planar substrates by a plasma-induced chemical vapor deposition in which plasma electrodes provide a plurality of overlapping plasma columns which extend over the entire surface of the substrate to be coated. A plurality of plasma electrodes are fixed in planes above, between, or below the substrates, and the individual plasma electrodes can be separately controlled. With a plasma pulse/CVD process, the spacing and angle between the substrates can be varied to alter the thickness of the coating. The process can be used for coating large area, planar vitreous bodies with multilayer optical coatings.

REFERENCES:
patent: 4525381 (1985-06-01), Tanaka et al.
patent: 4539068 (1985-09-01), Takagi et al.
patent: 4593644 (1986-06-01), Hanak
patent: 4633811 (1987-01-01), Maruyama
Abstract of the Disclosure, German Patent No. OS 3,326,020, 1.31.1985.
J. Kieser and M. Neusch, "Industrial Microwave Plasma Polymerization," Thin Solid Films, 118 (1984) 203-210.

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