Plasma CVD process for coating a basic tool body

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 38, 427249, B05D 306, C23C 1600

Patent

active

050931512

ABSTRACT:
A plasma-activated CVD process provides improved adhesion of the coated surface layers and employs, as the plasma exciting source, a pulsed direct voltage and a residual direct voltage which remains during the pulse intervals. The residual direct voltage is equal to or greater than the lowest ionization potential of the gases participating in the CVD process, but is no more than 50% of the maximum value of the pulsed direct voltage. The total thickness of the layer(s) does not exceed 30 .mu.m and the temperature of the basic tool body during the coating process is reduced, compared to prior art plasma CVD processes, and ranges from between 400.degree. to 800.degree. C., and is preferably kept below 600.degree. C.

REFERENCES:
patent: 4500563 (1985-02-01), Ellenberger et al.
patent: 4675200 (1987-06-01), Ikegaya
patent: 4720437 (1988-01-01), Chudo et al.
patent: 4758451 (1988-07-01), van den Berg
patent: 4915977 (1990-04-01), Okamoto et al.

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