Plasma conditioning of a substrate for electroless plating

Details Plasma conditioning of a substrate for electroless plating Plasma conditioning of a substrate for electroless plating

1988-09-30

1990-09-11

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 40, 427 96, 427 98, 427304, 427305, 427306, 156643, C23C 1804, B05D 306, B05D 304

Patent

active

049561979

ABSTRACT:
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by exposing the substrate to a gaseous plasma obtained from ammonia and/or an organic amine. The conditioning can be in the holes and/or on the surfaces of the substrate.

REFERENCES:
patent: 4568562 (1986-02-01), Phillips
patent: 4597828 (1986-07-01), Tadrou
patent: 4615763 (1986-10-01), Gelorme
patent: 4707394 (1987-11-01), Chant

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