Plasma based soldering method requiring no additional heat sourc

Details Plasma based soldering method requiring no additional heat sourc Plasma based soldering method requiring no additional heat sourc

1991-06-03

1993-06-29

Reynolds, Bruce A.

Electric heating

Metal heating

By arc

219 8522, 2281801, B23K 900

Patent

active

052236919

ABSTRACT:
A plasma based soldering method which uses a hydrogen-nitrogen gas mixture (5-15% hydrogen) to form a plasma, excited to simultaneously clean and heat solder. Only a relatively low vacuum of about 125 pascal (1 torr) is required. No heat sources beside the plasma are used to reflow the solder and no flux is necessary. Sensitive components can be shielded from plasma ion bombardment and need not be able to withstand the melt temperature of the solder used. The method is suitable for lead-tin solder and can be used to solder polyetherimide baseplates to teflon-glass printed wiring boards at junctions of gold-plated posts and matching gold-plated hole linings.

REFERENCES:
patent: 4921157 (1990-05-01), Dishon et al.
patent: 5000819 (1991-03-01), Pedder et al.
patent: 5128506 (1992-07-01), Dahne et al.
patent: 5139193 (1992-08-01), Todd
IBM Technical Disclosure, vol. 21, No. 7, "Chip-To-Pin Carrier Interconnection Systems", Ng, C.S.K., Dec. 1978.

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