Planting device for planting solder balls onto a chip

Details Planting device for planting solder balls onto a chip Planting device for planting solder balls onto a chip

2005-04-26

2005-04-26

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S049500, C029S843000

Reexamination Certificate

active

06883698

ABSTRACT:
A planting device for planting solder balls onto a chip includes a main board with a plurality of apertures for accommodating solder balls, and a fixture for fixing the chip under the main board. The chip is coated with a layer of adhesive for adhering the solder balls accommodated inside the apertures onto the chip.

REFERENCES:
patent: 5839191 (1998-11-01), Economy et al.
patent: 5921458 (1999-07-01), Fan
patent: 6003757 (1999-12-01), Beaumont et al.
patent: 6253992 (2001-07-01), Fjelstad
patent: 6268275 (2001-07-01), Cobbley et al.
patent: 6276598 (2001-08-01), Cheng et al.
patent: 20020166886 (2002-11-01), Inoue et al.

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