Plant for the manufacture of printed-circuit boards or multi-lay

Details Plant for the manufacture of printed-circuit boards or multi-lay Plant for the manufacture of printed-circuit boards or multi-lay

1990-10-23

1993-06-29

Jones, W. Gary

Coating apparatus

Immersion or work-confined pool type

Work-confined pool

118423, 118600, 118602, 118 73, B05C 302

Patent

active

052230376

ABSTRACT:
A plant for the manufacture of feedthrough (through-hole plated) printed-circuit boards or multilayers which comprises four modules (1, 11, 16, 21) through which the objects (3) to be treated are passed in a horizontal continuous process. In the first module (1) the surfaces to be coated are conditioned in an alkaline aqueous solution. An oxidative pre-treatment of the surfaces to be coated takes place in the second module (11). In the third module (16) a coating of organic monomers is deposited on the surfaces to be coated. Finally, in the fourth module (21) the deposited monomers are polymerized to form an electrically conductive coating. The printed-circuit boards or multilayers (3) thus treated and made electrically conductive on the lateral surfaces of the drill-holes are then passed on for the metallization of the lateral surfaces of the drill-holes (FIG. 1).

REFERENCES:
patent: 3752381 (1973-08-01), Watson, Jr.
patent: 4608941 (1986-09-01), Morris
patent: 4839056 (1989-06-01), Cahn
patent: 4964365 (1990-10-01), D'Amato

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