Planned coordinate component placement system

Details Planned coordinate component placement system Planned coordinate component placement system

1984-03-28

1985-10-22

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

29740, 156556, B65G 5904

Patent

active

045486670

ABSTRACT:
The present invention is generally related to devices which place surface-mounted (leadless) electronic components on recipient materials such as printed wiring boards or ceramic substrate and is more particularly concerned with a group of devices whose combined functions result in a systematized method of identifying suitable surface-mounted component location points on recipient material, and then placing the components at these location points en masse, in groups, or one at a time, as positioning requirements dictate.

REFERENCES:
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4292116 (1981-09-01), Takahashi et al.
patent: 4375126 (1983-03-01), Doll et al.

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