Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2007-10-02
2007-10-02
Deo, Duy-Vu N (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S691000, C438S692000, C438S693000
Reexamination Certificate
active
10968827
ABSTRACT:
Planarizing solutions, planarizing machines and methods for planarizing microelectronic-device substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. In one aspect of the invention, a microelectronic-device substrate assembly is planarized by abrading material from the substrate assembly using a plurality of first abrasive particles and removing material from the substrate assembly using a plurality second abrasive particles. The first abrasive particles have a first planarizing attribute, and the second abrasive particles have a second planarizing attribute. The first and second planarizing attributes are different from one another to preferably selectively remove topographical features from substrate assembly and/or selectively remove different types of material at the substrate surface.
REFERENCES:
patent: 4959113 (1990-09-01), Roberts
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5264101 (1993-11-01), Demorest et al.
patent: 5527423 (1996-06-01), Neville et al.
patent: 5647989 (1997-07-01), Hayashi et al.
patent: 5725417 (1998-03-01), Robinson
patent: 5786275 (1998-07-01), Kubo
patent: 5863838 (1999-01-01), Farkas et al.
patent: 5868896 (1999-02-01), Robinson et al.
patent: 5869392 (1999-02-01), Kimura
patent: 5882248 (1999-03-01), Wright et al.
patent: 5893754 (1999-04-01), Robinson et al.
patent: 5904159 (1999-05-01), Kato et al.
patent: 5932486 (1999-08-01), Cook et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5981396 (1999-11-01), Robinson et al.
patent: 6046111 (2000-04-01), Robinson
patent: 6077437 (2000-06-01), Hayashi et al.
patent: 6083840 (2000-07-01), Mravic, deceased et al.
patent: 6093649 (2000-07-01), Roberts et al.
patent: 6106714 (2000-08-01), Chiu et al.
patent: 6106728 (2000-08-01), Iida et al.
patent: 6124207 (2000-09-01), Robinson et al.
patent: 6126531 (2000-10-01), Iida et al.
patent: 6165048 (2000-12-01), Russ et al.
patent: 6352469 (2002-03-01), Miyazaki et al.
patent: 6402884 (2002-06-01), Robinson et al.
patent: 6407000 (2002-06-01), Hudson
patent: 2004/0198195 (2004-10-01), Hudson
Meikle Scott G.
Robinson Karl M.
Deo Duy-Vu N
Dorsey & Whitney LLP
Micro)n Technology, Inc.
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