Abrasive tool making process – material – or composition – With synthetic resin
Reexamination Certificate
2007-05-29
2007-05-29
Marcheschi, Michael A. (Department: 1755)
Abrasive tool making process, material, or composition
With synthetic resin
C051S307000, C051S308000, C051S309000, C051S293000, C427S212000, C427S421100, C427S427000
Reexamination Certificate
active
11170295
ABSTRACT:
A planarizing slurry for mechanical and/or chemical-mechanical polishing of microfeature workpieces. In one embodiment, the planarizing slurry comprises a liquid solution and a plurality of abrasive elements mixed in the liquid solution. The abrasive elements comprise a matrix material having a first hardness and a plurality of abrasive particles at least partially surrounded by the matrix material. The abrasive particles can have a second hardness independent of the first hardness of the matrix material. The second hardness, for example, can be greater than the first hardness. The matrix material can be formed into a core having an exterior surface and an interior. Because the abrasive particles are at least partially surrounded by the matrix material, the abrasive particles are at least partially embedded into the interior of the core.
REFERENCES:
patent: 2692863 (1954-10-01), Iler
patent: 4498345 (1985-02-01), Dyer et al.
patent: 4501258 (1985-02-01), Dyer et al.
patent: 4502459 (1985-03-01), Dyer
patent: 4971021 (1990-11-01), Kubotera et al.
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5163334 (1992-11-01), Li et al.
patent: 5209816 (1993-05-01), Yu et al.
patent: 5222329 (1993-06-01), Yu
patent: 5240552 (1993-08-01), Yu et al.
patent: RE34425 (1993-11-01), Schultz
patent: 5354490 (1994-10-01), Yu et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5433649 (1995-07-01), Nishida
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5439551 (1995-08-01), Meikle et al.
patent: 5476416 (1995-12-01), Kodate
patent: 5540810 (1996-07-01), Sandhu et al.
patent: 5573442 (1996-11-01), Morita et al.
patent: 5632666 (1997-05-01), Peratello et al.
patent: 5643048 (1997-07-01), Iyer
patent: 5663797 (1997-09-01), Sandhu
patent: 5668061 (1997-09-01), Herko et al.
patent: 5681204 (1997-10-01), Kawaguchi et al.
patent: 5738562 (1998-04-01), Doan et al.
patent: 5777739 (1998-07-01), Sandhu et al.
patent: 5798302 (1998-08-01), Hudson et al.
patent: 5827781 (1998-10-01), Skrovan et al.
patent: 5855804 (1999-01-01), Walker
patent: 5868896 (1999-02-01), Robinson et al.
patent: 5893754 (1999-04-01), Robinson et al.
patent: 5895550 (1999-04-01), Andreas
patent: 5910846 (1999-06-01), Sandhu
patent: 5916819 (1999-06-01), Skrovan et al.
patent: 5930699 (1999-07-01), Bhatia
patent: 5934973 (1999-08-01), Boucher et al.
patent: 5936733 (1999-08-01), Sandhu et al.
patent: 5981396 (1999-11-01), Robinson et al.
patent: 5990012 (1999-11-01), Robinson et al.
patent: 5994224 (1999-11-01), Sandhu et al.
patent: 6006739 (1999-12-01), Akram et al.
patent: 6007408 (1999-12-01), Sandhu
patent: 6040245 (2000-03-01), Sandhu et al.
patent: 6046111 (2000-04-01), Robinson
patent: 6057602 (2000-05-01), Hudson et al.
patent: 6060395 (2000-05-01), Skrovan et al.
patent: 6074286 (2000-06-01), Ball
patent: 6077785 (2000-06-01), Andreas
patent: 6108092 (2000-08-01), Sandhu
patent: 6116988 (2000-09-01), Ball
patent: 6124207 (2000-09-01), Robinson et al.
patent: 6136218 (2000-10-01), Skrovan et al.
patent: 6143123 (2000-11-01), Robinson et al.
patent: 6152803 (2000-11-01), Boucher et al.
patent: 6176763 (2001-01-01), Kramer et al.
patent: 6176888 (2001-01-01), Ritt et al.
patent: 6184571 (2001-02-01), Moore
patent: 6187681 (2001-02-01), Moore
patent: 6190494 (2001-02-01), Dow
patent: 6191037 (2001-02-01), Robinson et al.
patent: 6191864 (2001-02-01), Sandhu
patent: 6203404 (2001-03-01), Joslyn et al.
patent: 6206754 (2001-03-01), Moore
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6206757 (2001-03-01), Custer et al.
patent: 6206769 (2001-03-01), Walker
patent: 6208425 (2001-03-01), Sandhu et al.
patent: 6213845 (2001-04-01), Elledge
patent: 6234874 (2001-05-01), Ball
patent: 6234877 (2001-05-01), Koos et al.
patent: 6234878 (2001-05-01), Moore
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6261151 (2001-07-01), Sandhu et al.
patent: 6267650 (2001-07-01), Hembree
patent: 6271139 (2001-08-01), Alwan et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6287879 (2001-09-01), Gonzales et al.
patent: 6290572 (2001-09-01), Hofmann
patent: 6301006 (2001-10-01), Doan
patent: 6306012 (2001-10-01), Sabde
patent: 6306768 (2001-10-01), Klein
patent: 6312486 (2001-11-01), Sandhu et al.
patent: 6312558 (2001-11-01), Moore
patent: 6313038 (2001-11-01), Chopra et al.
patent: 6319420 (2001-11-01), Dow
patent: 6323046 (2001-11-01), Agarwal
patent: 6350180 (2002-02-01), Southwick
patent: 6354917 (2002-03-01), Ball
patent: 6354930 (2002-03-01), Moore
patent: 6362105 (2002-03-01), Moore
patent: 6364746 (2002-04-01), Moore
patent: 6368194 (2002-04-01), Sharples et al.
patent: 6375548 (2002-04-01), Andreas
patent: 6376381 (2002-04-01), Sabde
patent: 6402884 (2002-06-01), Robinson et al.
patent: 6407000 (2002-06-01), Hudson
patent: 6440185 (2002-08-01), Nagata et al.
patent: 6447369 (2002-09-01), Moore
patent: 6537133 (2003-03-01), Birang et al.
patent: 6551366 (2003-04-01), D'Souza et al.
patent: 6579799 (2003-06-01), Chopra et al.
patent: 6609947 (2003-08-01), Moore
patent: 6616725 (2003-09-01), Cho et al.
patent: 6740590 (2004-05-01), Yano et al.
patent: 2004/0020132 (2004-02-01), Yokoi
patent: 1020488 (2000-07-01), None
Kondo, S. et al., “Abrasive-Free Polishing for Copper Damascene Interconnection,” Journal of The Electrochemical Society, vol. 147, No. 10, pp. 3907-3913, 2000, The Electrochemical Society, Inc., Pennington, NJ.
Kawahashi, N. and M. Hattori, “An Evaluation on The Effects of Newly Designed Abrasives in CMP Slurry,” Mat. Res. Soc. Symp. Proc., vol. 671, pp. M2.2.1-M2.2.8, 2001, Materials Research Society, Warrendale, PA.
Choi, K.S. et al., “Engineered porous and coated Silica particulates for CMP applications,” Mat. Res. Soc. Symp. Proc., vol. 671, pp. M5.8.1-M5.8.10, 2001, Materials Research Society, Warrendale, PA.
Jindal, A. et al., “Chemical Mechanical Polishing Using Mixed Abrasive Slurries,” Electrochemical and Solid-State Letters, vol. 5, No. 7, pp. G48-G50, 2002, The Electrochemical Society, Inc., Pennington, NJ.
Yano, H. et al., “High-performance CMP Slurry with Inorganic/Resin Abrasive for AI/Low k Damascene,” Mat. Res. Soc. Symp. Proc., vol. 671, pp. M2.4.1-M2.4.5, 2001, Materials Research Society, Warrendale, PA.
Kawaguchi, H., “Functional polymer microspheres,” Prog. Polym. Sci., vol. 25, Issue 8, pp. 1171-1210, Oct. 2000, Elsevier Science Ltd.
Ishizu, K., “Synthesis and Structural Ordering of Core-Shell Polymer Microspheres,” Prog. Polym. Sci., vol. 23, Issue 8, pp. 1383-1408, Dec. 1998, Elsevier Science Ltd.
Lee, S-H. et al., “Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria,” J. Mater. Res., vol. 17, No. 10, pp. 2744-2749, Oct. 2002, Materials Research Society, Warrendale, PA.
Chandrasekaran Nagasubramaniyan
Taylor Theodore M.
Marcheschi Michael A.
Micro)n Technology, Inc.
Perkins Coie LLP
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