Planarizing layer for semiconductor substrates such as solid sta

Details Planarizing layer for semiconductor substrates such as solid sta Planarizing layer for semiconductor substrates such as solid sta

1983-10-21

1985-11-12

Sikes, William L.

H01S 300

Patent

active

045531536

ABSTRACT:
A device is disclosed comprising a non-planar semiconductor substrate and a planarizing layer thereon, the planarizing layer having a maximum thickness that is no greater than about 3.mu. and a planarization factor P.gtoreq.1.0. In a preferred embodiment, the layer comprises a polymer formed from a liquid monomer coated onto the substrate and thereafter polymerized.

REFERENCES:
patent: 4051374 (1977-09-01), Drexhage et al.
patent: 4136225 (1979-01-01), Feit et al.
patent: 4190446 (1980-02-01), Martin et al.
patent: 4196009 (1980-04-01), Martin et al.
patent: 4266017 (1981-05-01), Martin et al.
patent: 4285007 (1981-08-01), Nakano et al.
patent: 4362809 (1982-12-01), Chen et al.
patent: 4370405 (1983-01-01), O'Toole et al.
"Planarizing Topographical Features With Spun-On Polymer Coatings" by L. K. White, from the Kodak Microelectronics Seminar, 10/21/82, pp. 72-82.
"Color Filter Array for IC Image Sensor" by Manabe et al., from the 1983 IEEE Proceedings dated May 25, 1983, pp. 451-455.

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