Planarizing dielectric

Details Planarizing dielectric Planarizing dielectric

1990-04-05

1991-08-06

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524495, C08J 304, C08K 304, C08L 304

Patent

active

050378767

ABSTRACT:
A planarizing dielectric, which is particularly suitable for electronic components, fulfills the required properties to a high degree when it comprises a matrix of a high-temperature resistant, organic polymer, into which matrix is intercalated in fine distribution a solid filler material, which is etchable in oxygen plasma, has high thermal conductivity and good dielectric properties.

REFERENCES:
patent: 3700597 (1972-10-01), Kastenbein et al.
patent: 4738999 (1988-04-01), Blenner et al.
patent: 4845183 (1989-07-01), Mueller et al.
"A Novel Multilevel Metallization Technique for Advanced CMOS and Bioplar Integrated Circuits", V. Grewal et al., Jun. 9-10, 1986 V-MIC Conf., pp. 107-113.
"Polyimide Planarization in Integrated Circuits", appearing in K. L. Mittal, Polyimides, vol. 2, pp. 767-793, Plenum Press New York, 1984.

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