Planarizing apparatus with deflectable polishing pad

Details Planarizing apparatus with deflectable polishing pad Planarizing apparatus with deflectable polishing pad

1996-08-30

1998-07-28

Eley, Timothy V.

Abrading

Machine

Rotary tool

451287, 451495, 451528, B24B 500

Patent

active

057855846

ABSTRACT:
A planarizing system which significantly reduces the problems associated with non-uniform removal of surface material across the face of a semiconductor wafer or other comparable workpiece. The invention involves a planarizing apparatus that takes the leading edge of a wafer out of contact with the polishing pad while concomitantly enhancing slurry penetration and distribution at the polishing pad-wafer interface. This result is accomplished by combining: means for deflecting upward a portion of a flexible polishing pad as it passes in rotation beneath a wafer to form a raised polishing pad area, and means for positioning the wafer such that the wafer's leading edge overhangs the front edge of the raised polishing pad area during the planarization procedure. The invention also encompasses a method of using the planarizing apparatus to uniformly remove surface material across the face of a wafer.

REFERENCES:
patent: 5177908 (1993-01-01), Tuttle
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5234867 (1993-08-01), Schultz
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5377451 (1995-01-01), Leoni et al.
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5435772 (1995-07-01), Yu
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5558563 (1996-09-01), Cote et al.

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