Planarization process by applying a polish-differentiating techn

Details Planarization process by applying a polish-differentiating techn Planarization process by applying a polish-differentiating techn

1997-02-18

1999-12-21

Watkins, III, William P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

428901, 428156, 428195, 428543, 428409, 428410, 428913, 216 38, 216 62, 438705, 438692, 438690, 438691, 438693, 430 9, 430 11, 430 18, H01L 21302

Patent

active

060046538

ABSTRACT:
This invention discloses a method of planarizing a top surface with variations of profile heights above a substrate of a semiconductor chip. The method includes a step producing a polish-differentiating surface which has polishing rates proportional to the variations of the profile heights of the polish-differentiating surface above the substrate provided for performing a planarization process by applying a polishing process thereon. With the polishing differentiating surface the dishing effects of the semiconductor chip is substantially reduced when a one-time chemical mechanical polishing (CMP) process is applied for semiconductor chip planarization.

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patent: 5880003 (1999-03-01), Hayashi

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