Planarization of dielectric films on integrated circuits

Details Planarization of dielectric films on integrated circuits Planarization of dielectric films on integrated circuits

1988-03-18

1991-01-08

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437229, 430311, 430314, 430317, H01L 21465

Patent

active

049835459

ABSTRACT:
A method for the geometry independent planarization of dielectric films on integrated circuits is disclosed.
The method comprises forming the dielectric film, forming a polymer layer which polymer has the viscosity of 5,000 cps or less at 200.degree. C., reducing the viscosity of the polymer under baking to create a planar surface, hardening the polymer by the radiation or the electric beam and etching said polymer layer to transfer the planar surface to said dielectric film.

REFERENCES:
patent: 4222792 (1980-09-01), Lever et al.
patent: 4604162 (1986-08-01), Sobczak
patent: 4665010 (1987-05-01), Herd et al.
Wolf, "Silicon Processing . . . ", 1986, pp. 452-455.

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