Planarization layer for micro-fluid ejection head substrates

Details Planarization layer for micro-fluid ejection head substrates Planarization layer for micro-fluid ejection head substrates

2011-03-15

2011-03-15

Hsieh, Shih-Wen (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S063000, C347S067000

Reexamination Certificate

active

07905569

ABSTRACT:
A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.

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