Etching a substrate: processes – Forming or treating article containing magnetically...
Reexamination Certificate
2007-05-29
2007-05-29
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Forming or treating article containing magnetically...
Reexamination Certificate
active
10109929
ABSTRACT:
A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.
REFERENCES:
patent: 4339522 (1982-07-01), Balanson et al.
patent: 4818658 (1989-04-01), Martin et al.
patent: 5095613 (1992-03-01), Hussinger et al.
patent: 5404256 (1995-04-01), White
patent: 5509554 (1996-04-01), Samuelson et al.
patent: 5516430 (1996-05-01), Hussinger
patent: 5617273 (1997-04-01), Carr et al.
patent: 5932113 (1999-08-01), Kurdi et al.
patent: 6372407 (2002-04-01), Liu et al.
Chang Ping-Wei
Jackson Brad Lee
Kurdi Bulent Nihat
Lu Jennifer
McKean Dennis Richard
Culbert Roberts
Hassanzadeh Parviz
Zilka-Kotab, PC
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