Planarization fluid composition including chelating agents

Details Planarization fluid composition including chelating agents Planarization fluid composition including chelating agents

1999-02-26

2000-10-24

Powell, William

Compositions

Etching or brightening compositions

252 795, 252 792, 252 794, 252 793, C09K 1300

Patent

active

061362182

ABSTRACT:
A planarization method including the provision of a wafer having a wafer surface. A pad is positioned for contact with the wafer surface and the wafer surface is planarized using the pad and a fluid composition that includes a chelating agent. The chelating agent is a water soluble multidentate chelating agent, preferably a water soluble bidentate ionic chelating agent, and more preferably 1,2-ethylenediphosphonic acid (EDP). A fluid composition for use in planarization of a surface of a wafer includes a chemically interactive component that interacts with the surface of the wafer and a chelating agent for reducing the metal ion contamination of the wafer during planarization. The chelating agent may be one of a water soluble multidentate chelating agent, preferably a water soluble bidentate ionic chelating agent, and more preferably 1,2-ethylenediphosphonic acid (EDP). Further, the fluid composition may include an abrasive component.

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